Esko has extended a multi-million dollar in-kind donation to support college and university students in their packaging engineering and technology studies. Through this donation, students will be able to design and create packaging systems from ideation through to virtual and physical prototypes, preparing them for future roles in what is a diverse and fast-paced packaging industry.
Melissa Plemen, Esko Sr. Director of Inside Sales and Marketing, said the company was thrilled to continue supporting the education of the next generation of packaging employees with the donation. “It’s widely accepted that our sector has an aging workforce and a skills gap continues to become more and more apparent,” she explained. “As technological advances lead to changes within the sector, it’s vitally important that the industry supports the education and training of young people as we drive to develop and inspire the packaging experts of the future.”
Among the more-than-40 schools utilizing Esko software are Clemson University, Cal Poly University, Rochester Institute of Technology, Ryerson University, University of Wisconsin – Stout, Dunwoody College of Technology, Michigan State University and Indiana State University.